The Global Market for Selective Soldering Equipment is Projected to Reach US$63.5 Million by 2022

Increase in Component Density & Complexity Drives the Selective Soldering Equipment Market, According to a New Report by Global Industry Analysts, Inc.

GIA launches comprehensive analysis of industry segments, trends, growth drivers, market share, size and demand forecasts on the global Selective Soldering market. The global market for Selective Soldering Equipment is projected to reach US$63.5 million by 2022, driven by shrinking component size, rising component density and complexity, and growing investments in new generation semiconductor manufacturing equipment.

Soldering, comprising Reflow soldering and Wave soldering, is the process of bonding the placed components to the printed circuit board, to facilitate electrical connections between them. Selection of soldering method depends on the mix of through-hole and surface mount components in the printed board assembly. Type I assemblies are reflow soldered using vapor phase or infrared rays, while type II and type III assemblies use both wave and reflow soldering for through-hole and surface mount components respectively. The technology of selective soldering is the result of a combination of factors including the drive towards miniaturization in electronic devices and the increase in the use of temperature-sensitive and expensive components by the telecom equipment industry. Simplified programming, flexible innovations, and better user interfaces are contributing towards the growth of selective soldering into a reliable replacement for custom pallets wave soldering and/or manual soldering. In comparison to hand-soldering, selective soldering systems provide higher ROI by lowering labor and production costs.

Selective soldering systems available in the market range from small bench-top versions with limited automated potential to expensive automated machines. Accordingly, the price range between low-end models and high-performance machines is also broad. Especially popular are semi-automatic models or machines featuring in-line capability or medium level of capability for product handling. Laser soldering offers a cost effective process of selective soldering of TH components when the three methods including the wave, convention reflow and hand methods are either technically impossible or are too expensive. The main advantage of laser soldering lies in the fact that no special fixtures are required and that the soldering technique is capable of soldering both TH and SMT components. Laser soldering also provides significant amount of flexibility, repeatability and quality. The drive towards miniaturization of electronic components used mainly in telecom equipment and the increasing use of components that are temperature sensitive are being touted as key factors for growth of laser soldering. Laser soldering has lately become the most desirable technique for soldering difficult-to-reach areas where reflow and wave soldering techniques cannot solder.

As stated by the new market research report on Selective Soldering, Asia-Pacific represents the largest market worldwide. Trailing a CAGR of 9.0% over the analysis period, the region also ranks as the fastest growing market, led by stable GDP gains, and expanding semiconductor manufacturing base in countries such as China, Taiwan and South Korea.  

Major players covered in the report include ACE Production Technologies, Inc., DDM Novastar LLC, Ebso GmbH, EPM Handels AG, ERSA GmbH, FTM Technologies, INERTEC Löttechnologien GmbH, Japan Unix Co. Ltd., Juki Automation Systems, Inc., Pillarhouse USA, Inc., RPS Automation, LLC, SEHO Systems GmbH, Shenzhen JT Automation Equipment Co., Ltd., Tai'an Puhui Electric Technology Co., Ltd., Tamura H.A. Machinery, Inc., and Vitronics Soltec BV, among others.

The research report titled “Selective Soldering: A Global Strategic Business Report” announced by Global Industry Analysts Inc., provides a comprehensive review of market trends, issues, drivers, mergers, acquisitions and strategic industry activities of global companies. The report provides market estimates and projections for Selective Soldering in US$ for all major geographic markets such as the US, Canada, Japan, Europe (France, Germany, Italy, UK, Spain, Russia and Rest of Europe), Asia-Pacific (China, South Korea, Taiwan, and Rest of Asia-Pacific), Latin America and Rest of World.

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