The Global Market for Thin Layer Deposition Equipment in Semiconductor Applications is Projected to Reach US$13.6 Billion by 2020
Increasing Semiconductor Manufacturing Activity Drives
the Global Thin Layer Deposition Equipment Market, According to New Report by Global Industry Analysts, Inc.
GIA announces the release of a comprehensive global report on Thin
Layer Deposition Equipment. The global market for Thin Layer Deposition Equipment in
semiconductor applications is projected to reach US$13.6 billion by 2020, driven by expanding electronics industry and parallel growth in demand
for semiconductor solutions.
Defined as the
building block of miniaturization and MEMS processing, thin layer deposition is
a critical part of the fabrication process and represents a key element in the
production of all electronic devices. Numerous
deposition systems are used in manufacture of different categories of
semiconductors in application areas such as copper interconnects /electrodes,
copper barrier/seed layers beyond 70nm, Hi K dielectric gate stacks, and Gap
dielectrics, among others. Healthy growth in demand for fab and wafer continues
to maintain sustained growth in the semiconductors market in tandem with robust
sales of consumer electronic products. Additionally, high demand for automotive
electronics and industrial electronic equipment also continue to push the
demand for semiconductors.
The high tempo
in semiconductor market is generating persistent demands for sophisticated,
high-performance packaging equipment from fab and wafer manufacturers. Advanced, feature-rich Physical Vapor Deposition (PVD), Chemical
Vapor Deposition and Atomic
Layer Deposition (ALD) systems are designed and developed for delivering
best-in-class deposition performance, high wafer/hour production rates, and
reduced wastage. High-quality ferromagnetic thin films, gallium nitride (GaN)
structures, Nano-deposition and 3D modelling are some of the new generation
concepts being studied in semiconductor R&D. In order to study and analyze
the complex substrates as well as tool design, several semiconductor R&D
labs are increasingly adopting sophisticated CVD, PVD or ECD systems thus
benefit market expansion in the coming years.
As stated by
the new market research report on Thin Layer Deposition Equipment, Taiwan
represents the largest market worldwide. Rest of World represents the fastest
growing market with a projected CAGR of 16.1% over the analysis period. Among
various types of equipment, Chemical Vapor Deposition (CVD) equipment
represents the largest equipment type. Atomic Layer Deposition (ALD) represents
the fastest growing equipment category driven by increasing adoption in the
production of advanced semiconductor solutions for use in new generation
electronic gadgets such as mobile phones, smartphones, PDAs, DVD players,
portable media players, video games, home-theater systems, microwaves, and
printers, among others.
Key players
covered in the report include AIXTRON SE, Applied Materials Inc., ASM
International N.V., Canon ANELVA Corporation, CHA Industries Inc., CVD
Equipment Corporation, Denton Vacuum LLC, Edwards Limited, Ionbond AG, Jusung
Engineering Co. Ltd., KDF Electronic & Vacuum Services Inc., Kokusai
Semiconductor Equipment Corporation, Lam Research Corporation, RIBER SA, Seki
Diamond Systems, Silicon Genesis Corporation, SPTS Technologies, Taiyo Nippon
Sanso Corporation, Ti-Coating Inc., Tokyo Electron Limited, ULVAC Technologies
Inc., Vapor Technologies Inc. and Veeco
Instruments Inc., among others.
Comments
Post a Comment