The Global Market for Flexible Printed Circuit Boards is Projected to Reach US$28.4 Billion by 2024
Material Advancements and
Design & Packaging Flexibility Drive the Flexible Printed Circuit Boards
Market, According to a New Report by Global Industry Analysts,
Inc.
GIA
launches comprehensive analysis of industry segments, trends, growth drivers,
market share, size and demand forecasts on the global Flexible Printed Circuit
Boards market. The global market for Flexible
Printed Circuit Boards is projected to reach US$28.4 billion by 2024, driven by material and
design advancements enabling stretchable interconnects in flexible circuits; superior
packaging flexibility; and miniaturization needs in circuit designing.
Printed
circuit board (PCB), a key technology playing significant role in advancement
of various electronic components that power electronic devices, handles the job
of routing electric signals between components as well as connecting RF and
analogue circuits for efficient passage of electricity to perform intended
functions. While the technology has existed and improved over several years, designers
of electronics devices face the challenge of squeezing more and more
functionality into as limited space as possible. Flexible printed circuit
boards (FPCs), also known as flexible circuits or flex circuits, have over the
years become the preferred PCB technology variant to address growing
miniaturization as well as superior functionality needs of electronics
products. Flexible circuitry is an enabling technology that plays a pivotal
role in addressing current and future design requirements of the end-use
electronic goods. A key driver behind the growth of FPCs is the emergence of
new technologies as well as applications that surface virtually on a daily
basis. Once used mainly in devices such as cameras, laptops and smartphones,
flexible circuits now feature in a range of other devices that are visible in
cars, on human body and in space, virtually everywhere.
While metallization of circuits and other issues remain,
the future of the technology appears brighter and their use is likely to become
more widespread in usage as technology advances. Factor driving growth in
demand for FPCs is that designers and fabricators have the option of choosing
from simple to advanced forms of versatile interconnects, providing them with
various assembly possibilities. The growing demand for hand held devices and
smartphones, increasing interest in Internet of Things (IoT) and growing
adoption of FPCs in diverse sectors such as automotive, consumer electronics,
industrial electronics, healthcare, telecommunication, aerospace and defense is
driving the global market growth. Technological advances in substrate and
conductive materials, and developments in fabrication such as copper etching techniques are also helping
drive growth in the market. With growing focus on improving capabilities such as
better clock speeds, higher processing power and lower power usage,
manufacturers of flex circuits are migrating towards the use of board stack-ups
that are more complex in structure and function. Stretchable circuits are emerging in the market with the promise of
enabling reliable design of electronic wearables.
As
stated by the new market research report on Flexible Printed Circuit
Boards, Asia-Pacific
represents the largest market worldwide, supported by its dominance as the global
hub for the production of electronic products. The region is also home to a vast
majority of major flexible circuit producers. Asia-Pacific also ranks as the
fastest growing market with a CAGR of 11.2% over the analysis period, driven by
encouraging gains in electronics production against the backdrop of
digitalizing lifestyles of the growing base of affluent middle-class population
and the ensuing robust appetite for consumer electronics. Other major markets
include the US, Europe and Japan.
Major
players in the market include 3M Company, BHflex Co., Ltd., Career Technology
(MFG.) Co., Ltd., Daeduck GDS Co., Ltd., Flexcom Inc. , Flexium Interconnect,
Inc., Fujikura Ltd., Ichia Technologies, Inc., Interflex Co., Ltd., MFS
Technology, Multi-Fineline Electronix, Inc. (MFLEX), Newflex Technology Co.,
Ltd., Nippon Mektron, Ltd., Nitto Denko Corp., SIFlex Co., Ltd., Sumitomo
Electric Industries, Ltd., Xiamen Hongxin Electron-Tech Co., Ltd., and Zhen
Ding Technology Holding Limited (ZDT), among others.
The
research report titled “Flexible Printed Circuit
Boards: A Global Strategic Business Report” announced by Global Industry Analysts Inc.,
provides a comprehensive review
of market trends, issues, drivers, mergers, acquisitions and other strategic
industry activities of global companies. The report provides market estimates
and projections for Flexible Printed Circuit Boards in terms of US$ for all
major geographic markets such as the US, Canada, Japan, Europe (France,
Germany, Italy, UK, Spain, Russia and Rest of Europe) Asia-Pacific (China, South
Korea, Taiwan and Rest of Asia-Pacific), Latin America and Rest of World. The
report also analyzes the Flexible Printed Circuit Boards market at the global
level by end-use segments - Automotive, Consumer Electronics, Industrial, and
Others.
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enquiries e-mail us at rsd@strategyr.com or info411@strategyr.com.
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