The Global Market for 3D TSV Devices is Projected to Reach US$67.9 Billion by 2020
Focus on Advanced Electronic Packaging Drives the
Global 3D TSV Devices Market, According to a New Report by Global Industry Analysts, Inc.
GIA launches comprehensive analysis of
industry segments, trends, growth drivers, market share, size and demand
forecasts on the global 3D TSV Devices market. The global market for 3D TSV Devices is projected to
reach US$67.9 billion by 2020, driven
by the growing trend to reduce package dimensions of components in electronic
systems.
Three-Dimensional (3D)
Through-Silicon-Via (TSV) technology is steadily gaining importance as a
highly-advanced semiconductor packaging model that dramatically improves chip
performance and functionality. 3D TSV devices possess stacked silicon wafers interconnected vertically
by employing TSVs. The 3D TSV devices offer
numerous benefits in wafer/chip assembly, which include superior performance as
compared to conventional techniques, reduction in package size, heterogeneous
integration, and superior performance. Driven by the growing demand for
innovative, high-performance chip architectures featuring benefits such as
superior performance, power consumption and form factor features, 3D TSV
technology is making robust progress in the semiconductor industry. The growth
in the 3D TSV advanced wafer packaging technology market is currently
fuelled by factors such as robust outlook for the Information &
Communication Technologies (ICT) sector, expansion in communication services
provider (CSP) operations, intensified activity in corporate data centers, and
growing proliferation of cloud computing services.
Future growth in the market will be
chiefly driven by large-scale opportunities in application areas such as
memory, MEMS, CMOS image sensors, imaging & optoelectronics, and advanced
LED packaging among others. Leveraging its ability to deliver advanced integrated chip
models with smaller footprint and reduced capacitance, 3D TSV technology is
increasingly being pursued in enhancing the CMOS, memory, non-memory, and logic
functions of electronics such as smartphones, tablet PCs, and televisions among
others. The proliferation of 3D TSV in the DRAM memory vertical with innovative
technology platforms such as Hybrid Memory Cube (HMC), High Bandwidth Memory
(HBM), and Wide I/O is also helping drive growth in the market.
As stated by the new
market research report on 3D TSV Devices,
the United States represents the largest market worldwide. Asia-Pacific ranks
as the fastest growing market with a CAGR of 44.7% over the analysis period led
by the robust Chinese, South Korean and Taiwanese markets.
Major players in the market include Amkor
Technology Inc., GLOBALFOUNDRIES, Invensas Corporation, Iwate Toshiba
Electronics Co. Ltd., Micron Technology Inc., Samsung Electronics Co. Ltd., SK
Hynix Inc., Sony Corporation , STATS ChipPAC Ltd., Taiwan Semiconductor
Manufacturing Company Limited (TSMC), Teledyne DALSA Inc., Tezzaron
Semiconductor Corp., United Microelectronics Corporation (UMC) , and Xilinx
Inc., among others.
The research report titled
“3D TSV Devices: A Global Strategic Business Report” announced by Global Industry Analysts Inc., provides
a comprehensive review of market
trends, issues, drivers, mergers, acquisitions and other strategic industry
activities of global companies. The
report provides market estimates and projections for all major geographic
markets such as the US, Canada, Japan, Europe, Asia-Pacific (China, South
Korea, and Rest of Asia-Pacific), and Rest of World.
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