The Global Market for System-in-Package (SiP) Technology is Projected to Reach US$28.5 Billion by 2022

Small Form Factor, High Performance & Energy Efficiency Needs of Modern Electronics Drives Demand for System-in-Package Technology, According to a New Report by Global Industry Analysts, Inc.

GIA launches comprehensive analysis of industry segments, trends, growth drivers, market share, size and demand forecasts on the global System-in-Package (SiP) Technology market. The global market for System-in-Package (SiP) Technology is projected to reach US$28.5 billion by 2022, driven by the growing trend towards miniaturized, faster processing, energy efficient and high-performance electronics devices.

System in package (SiP), is a semiconductor packaging technology, which can reduce power consumption, improve efficiency, and lower system complexity. SiP is emerging as a critical technology in the electronics industry, against the backdrop of device miniaturization trend and sustained focus on advancements aimed at performance improvement and cost reduction of portable electronics. The growing consumer demand for smaller, high-performance, and faster electronic devices with more functionality is driving increased adoption of advanced packaging techniques that utilize lateral or vertical integration technologies. The need to reduce cost per function of ICs and the design complexities associated with System on Package (SoC) technique are also driving focus onto SiP technology.

The growing needs of the electronics industry and the steady shift towards advanced IC packaging techniques are expected to drive adoption of SiP technology in consumer electronics, automotive, and telecommunication applications. In particular, the increased demand for high performance and miniaturized electronics is promoting utilization of SiP technology in the consumer electronics industry. The market also benefits from the rising demand for portable electronics, trend towards Internet of Things (IoT), and growing need for circuit miniaturization, particularly in microelectronic devices. Also driving growth are low cost of development, enhanced flexibility in product design, and improved functionality with smaller size when compared to separately packaged ICs.

Consumer Electronics represents the largest end-use market, fuelled by the escalating sales of high-performance and miniature electronic devices. Specifically, rising sales of smartphones, laptops and tablets and growing popularity of smart homes concept are pushing electronic device manufacturers to upgrade design, user interface and processing power of their products. This need for creating compact devices will push semiconductor makers to develop highly dense ICs featuring complex circuitry network, thus propelling demand for advanced IC packaging approaches like SiP.

As stated by the new market research report on System-in-Package (SiP) Technology, Asia-Pacific represents the largest market worldwide. Asia-Pacific also ranks as the fastest growing market led by the fact that Asian countries remain global hotspots for semiconductor growth. Other factors driving growth in the region include strong manufacturing and design of advanced semiconductors in countries such as Singapore, Malaysia, Thailand, Indonesia, Taiwan, South Korea; increasing focus on research and innovation and a parallel spurt in investments in new generation technologies; strong domestic demand for consumer, industrial and automotive electronics against the backdrop of digitalizing lifestyles, growing investments in industrial automation, and robust demand for intelligent automobiles.

Major players in the market include Amkor Technology Inc., ASE Group, ChipMOS Technologies Inc., Fujitsu Limited, GS Nanotech, Insight SiP, Intel Corporation, Jiangsu Changjiang Electronics Technology Co. Ltd., Powertech Technologies Inc., Renesas Electronics Corporation, Samsung Electronics Co. Ltd., ShunSin Technology (Zhongshan) Limited, Si2 Microsystems Private Limited, and STATS ChipPAC Ltd., among others.

The research report titled “System-in-Package (SiP) Technology: A Global Strategic Business Report” announced by Global Industry Analysts Inc., provides a comprehensive review of market trends, issues, drivers, mergers, acquisitions and other strategic industry activities of global companies. The report provides market estimates and projections for all major geographic markets such as the US, Canada, Japan, Europe (France, Germany, Italy, UK and Rest of Europe), Asia-Pacific (China and Rest of Asia-Pacific) and Rest of World. Global market for System-in-Package (SiP) Technology is additionally analyzed by Interconnection Technology (Wire Bonding and Flip-Chip) and End-Use Sector (Consumer Electronics, Communications, Aerospace & Defense, Automotive and Others).

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